ISAAT 2007
Precision Grinding and Abrasive Technology
at SME International Grinding Conference
September 26-28, 2007, in Dearborn, Michigan
A CD containing 85 peer-reviewed papers reflecting the state-of-the-art research
Available from AES for $150 (may vary) plus shipping

Sorry no abstracts currently available, and papers not sold separately.
Grinding Fluid Applications
Analysis of Fluid Flow in the Grinding Using the Laser Doppler Anemometry (LDA) Technique
H. Wu, B. Lin, Y.D. Tridimas, and M.N. Morgan
Application of Flexible Fluid Supplying Sheet to High Speed Grinding
Toshiharu Shimizu, Manabu Iwai, Shinichi Ninomiya, Tetsutaro Uematsu, and Kiyoshi Suzuki
Grinding Fluid Alternatives
An Innovative Concept for Dry Grinding with Resin and Vitrified Bond CBN Wheel
Taghi Tawakoli and Mohammad Rabiey
Effect of Micro Bubble Coolant on Grinding with CBN Wheel
Kiyoshi Suzuki, Manabu Iwai, Shinichi Ninomiya, Toshiharu Shimizu, Akitake Hashidate, Hirohisa Arai, and Tetsutaro Uematsu
High-Speed Grinding with Electroplated cBN Wheels Using Oil vs. Waterbased Fluids
Jean M. Dasch, James B. D'Arcy, Hap Hanna, Yaming Yin, Richard Kopple, and Stuart Salmon
Water Soluble Oil Versus Straight Machining Oil for Production ID Grinding with Vitrified CBN
Mark Herrema
Processing Semiconductor Materials
The Effect of Temperature Characteristic on Si-Wafer Polishing for a Variable Machining Condition
Jong-Koo Won, Jung-Taik Lee, and Eun-Sang Lee
The Evaluation of Pressure Characteristics in Wafer Polishing with Variable Working Speed
Eun-Sang Lee, Jung-Taik Lee, and Jong-Koo Won
Study on Thinning Process of Large Size Si Wafer
T. Tsuruga, B. Soltani.H, J. Sasaki, T. Mitsuta, J. Shimizu, L. Zhou, and H. Eda
Development of On-Machine 3D Measuring System for Large Size Si Wafer Thinning Process
T. Mitsuta, B.S. Hosseini, T. Tsuruga, J. Sasaki, L. Zhou, J. Shimizu, and H. Eda
Estimation of Total Thickness Variation for Wafer Thinning by Diamond Grinding Process
Chao-Chang A. Chen and Li-Sheng Hsu
Effect of TiO2 and CeO2 Particles on SiC Semiconductor Surfaces Polished Under Ultraviolet-Ray Irradiation
Junji Watanabe, Seok-Hyoung Hong, Keishi Yamaguchi, Mutsumi Touge, and Noritaka Kuroda
Machining Titanium
Rotary Ultrasonic of Titanium Alloy: Experimental Investigations
P.F. Zhang, Z.J. Pei, and C. Treadwell
Finishing Characteristics on Titanium Materials of Different Phase in Dry Centrifugal Barrel Finishing
Koichi Kitajima and Akihiro Yamamoto
Cutting Tool and Mold Technology
Improvement of Tool Life of Small Drill by Using Megasonic Coolant
Manabu Iwai, Shinichi Ninomiya, Masashi Nishizaki, Hirohisa Arai, Tetsutaro Uematsu, and Kiyoshi Suzuki
Application of the NiP-Plated Steel Molds to Glass Lens Molding
Jun Masuda, Jiwang Yan, and Tsunemoto Kuriyagawa
Influence of Tool Run-Out on Mold Surface Texture
Hideki Shibahara, Mikito Kumagai, Seido Kohda, and Koichi Okuda
Basic Research on Miniature Machining by Miniature End Mill
T. Akamatsu, K. Kitajima, and Y. Matsumoto
Grinding Wheels
Comparative Study About the Effects of Alloying Additives on the Compact and Porous Metal-Bonded Diamond Composites
Qiulian Dai, Canbin Luo, and YuRong Lv
Microstructural Phase Formation in Surface Modified Vitrified Grinding Wheels
Mark J. Jackson and Grant M. Robinson
High Efficiency Monolayer Brazing Diamond Tool for Drilling
H.H. Su, H.J. Xu, B. Xiao, Y.C. Fu, and J.H. Xu
Fabrication and Characterization of Brazed CBN Wheels with Rhythmed Grain Distribution
Jiuhua Xu, Wenfeng Ding, and Yucan Fu
Surface Finishing (Analysis)
Differences in Effects of Cutting Edge Truncation on the Ground Surface Morphology Between Hard and Brittle Material and Ductile Material
Xijun Kang, Jun’ichi Tamaki, and Akihiko Kubo
Finite Element Analysis of the Hydrostatic Pressure and Temperature in Ductile Machining of Silicon
Jiwang Yan, Hongwei Zhao, and Tsunemoto Kuriyagawa
Finite Element Analysis of Silicon Wafer Polishing: Stress Distributions and Edge Effects
X.H. Zhang, Z.J. Pei, and Graham R. Fisher
Surface Finishing (Turbine Parts)
Research of Gas Turbine Disk Sharp Edges Rounding with Nylon Abrasive Brushes
V.F. Makarov and A.V. Vinogradov
Surface Finishing (Fluids)
A Study of Basic Characteristics of Polishing Using Electro-Rheological Fluid of Polymerized Liquid Crystal
Takeshi Tanaka
Study on Tribo-Fabrication in Polishing by Nano Diamond Colloid
Weimin Lin, Teruko Kato, Hitoshi Ohmori, and Eiji Osawa
The Organic Diamond Disk (ODD) for Chemical Mechanical Planarization
James C. Sung, Cheng-Shiang Chou, Chih-Chung Chou, Yang-Liang Pai, Wei Huang, Chia-Chun Wang, and Michael Sung
Tools and Tooling
Research on Helical Drill Point Grinding with a Bipod Parallel Grinder
P. Zou
Simulation of Squeeze Oil Film Damper in Ultrahigh Speed Grinding
Tianbiao Yu, Yadong Gong, Hu Li, and Wanshan Wang
Performance of Machining Tools Made of Boron Doped Diamond
Manabu Iwai, Shinichi Ninomiya, Yukinori Tanakai, Tetsutaro Uematsu, and Kiyoshi Suzuki
Development of a Cutting Tool with Micro Structured Surface (Cutting Performance of Aluminum Alloy with the Developed Cemented Carbide Tool)
Ryo Takasaki and Toshiyuki Enomoto
Process Measurement (Thermal)
Experimental and Analytical Analysis of the “Flash” Temperatures at the Wheel/Workpiece Interface in Fine Grinding
André Lefebvre, Paul Lipinski, and Pascal Vieville
Thermocouple Fixturing Method for Grinding Temperature Measurement
Bin Shen and Albert Shih
Grinding Temperature and Cooling Rate During Grind-Hardening of 40Cr Steel
B. Xiao, H.H. Su, S.S. Li, M.H. Yan, Y.C. Fu, J.H. Xu, and H.J. Xu
Process Monitoring
In-Process Measurement and Monitoring for Intelligent Optimization and Control of Grinding Processes
Radu Pavel and Anil Srivastava
Grinding Chatter Monitoring Using Least Square Support Vector Machine
Xun Chen and Thitikorn Limchimchol
Processes, Modeling, and Characteristics
Designing Methods of Electroabrasive Processing
E. Smolentsev
Friction Characteristics of Regulating Wheel in Centerless Grinding
Y. Wu and T. Tachibana
Force Modelling in Profiled Surface Grinding
S.J.H. Altena, V. Bana, and J.M. Derkx
Abrasive Processes
Study on the Key Technology of ELID Grinding on a Large Telescope Mirror
J. Guo, H. Ohmori, Y. Watanabe, S. Morita, and Y. Uehara
The Production of Automotive Crankshafts Using a High Material Removal Rate Grinding Process
P. Comley, W. Pflager, I. Walton, and D.J. Stephenson
Study of Helical Scan Groove Grinding—2nd Report: Application to R-Shaped Groove Grinding Yoichi Shiraishi, Manabu Iwai, Lingshi Lin, Tetsutaro Uematsu, and Kiyoshi Suzuki
Hybrid Processing of EDM and Grinding with an ED-T-Formed PCD Tool
Sadao Sano, Weili Pan, Manabu Iwai, Shinichi Ninomiya, Tetsutaro Uematsu, and Kiyoshi Suzuki
Abrasive Process Controls
Development of Table-Reciprocation-Control System for a Surface-Grinding Machine Using an Accelerometer
Akinori Yui, Shigeki Okuyama, and Takayuki Kitajima
Optimal Tool Dwell Time Computation in Computer-Controlled Surfacing
Hon-Yuen Tam, Hang-Wai Law, and Ka-Lok Liu
Improvement of an Automatic Wheel-Approach System Using a Hydrophone
Shigeki Okuyama, Akinori Yui, and Takayuki Kitajima
Grinding Special Materials (Metals)
Performance of Electroplated cBN Grinding Points Machining Udimet 720
D.T. Curtis, D.K. Aspinwall, S.L. Soo, C. Davis, and A.L. Mantle
Study of Internal Magnetic Field Assisted Finishing for Copper Tubes with Magneto-Rheological Fluid (MRF)-Based Slurry—Finishing Characteristics Using Low-Viscous MRF-Based Slurry
T. Sato, H. Yamaguchi, T. Shinmura, and T. Okazaki
Grinding Special Materials (Non-Metals)
Creep Feed Grinding of Gamma-TiAl Using Superabrasive Wheels
R. Hood, D.K. Aspinwall, W. Voice, P. Dando, and K. Tuffy
Thin Tools for the High Speed Cutting of Granite
B. Denkena, M. Reichstein, J. Bockhurst, and B. Wang
Investigation of the Micro-End Grinding of Ceramics Using a Sintered Metal-Bonded Microgrinding Wheel
J. Feng, G.-Y. Kim, A.J. Shih, and J. Ni
Surface Finishing (Pads)
The Wear Characteristics of Pad Conditioners for CMP Manufacture of Semiconductors
James C. Sung, Ming-Yi Tsai, Eiichi Nishizawa, and Michael Sung
Pad Dressing Using Oriented Single Diamond and Its Effect on Polishing Rate of Oxidized Silicon Wafer
Y.S. Liao, M.Y. Tsai, J.C. Sung, and Y.L. Pai
Groove Patterns of Pads for Oscillation Polishing Under High Rotational Speeds and Low Slurry Flow Rates
Kenichiro Yoshitomi, Atsunobu Une, and Masaaki Mochida
Development of Electric Field Assisted Polishing Technology Using ERG Abrasive Pad
Y. Kakinuma, S. Takezawa, T. Aoyama, M. Sagara, K. Tanaka, and H. Anzai
Nano/Micro Machining Technology
Study on Turning of Micro Shafts
Hwa-Soo Lee, Atsushi Toride, Takazo Yamada, and Shuichirou Araki
Ductile to Brittle Transition (DBT) of a Single-Crystal 4H-SiC Wafer by Performing Nanometric Machining
Deepak Ravindra, John Patten, and Makoto Tano
Study on Electrorheological Fluid Assisted Micro Ultrasonic Machining
T. Tateishi, N. Yoshihara, J. Yan, and T. Kuriyagawa
Nano/Micro Grinding Technology
Wear Performance of Ground Nanostructured Ceramic Coatings
Bi Zhang and XM Cheng
Grinding Force Prediction for Tungsten Carbides of Various Grain Sizes
Bi Zhang, YH Ren, and ZX Zhou
Precise and Micro V-Groove Grinding with Fine Grade PCD Wheel Formed by EDM
K. Suzuki, W. Pan, S. Sano, M. Iwai, and T. Uematsu
Technology Review
Grinding in the Aerospace Industry
Mike Hitchiner
High Process Quality with Fine Grinding Instead of Lapping
P. Dennis, D. Preising, and J. Sowada
Development of Micro cBN Milling Tool and Application to Precision Machining of Hardened Stainless Steel Molds
Hirofumi Suzuki, Hiroki Kawabata, Yuji Yamamoto, Toshimichi Moriwaki, Yuji Goto, and Katsuji Fujii
Measurement of Surfaces and Grains
Manufacturing of Functional Microstructured Surfaces by Grinding with Vitrified SiC- and CBN-Wheels
Berend Denkena, Martin Reichstein, and Bo Wang
Novel On-Machine Measurement of Surface Finish with Thermoelectric Effect for Rotating Ground Workpiece
Kazuhito Ohashi, Ryu Nagata, Shinya Tsukamoto, and Hiroyuki Hasegawa
Effects of the Embedding Depth on the Residual Stresses in the Brazed Cubic Boron Nitride
Abrasive Grain
Wenfeng Ding, Jiuhua Xu, Yucan Fu, Honghua Su, and Bing Xiao
Uncertainty and Quality in the Measurement and Characterization of the Texture of Abrasive Media
C.A. Brown, B.M. Powers, and T.S. Bergstrom
Machining Glass Materials
Subsurface Damage Caused During Rapid Grinding of Zerodur®
X. Tonnellier, P. Morantz, P. Shore, A. Baldwin, R. Evans, and D.D. Walker
Delayed Crack Developing on Ductile Mode-Machined Glass Surface
T. Kaneeda, H. Harada, T. Nishioka, and L. Anthony
Design of a Ball End Mill for Glass Cutting
Takashi Matsumura, Takenori Ono, Haruki Kino, and Yasushi Sakamoto
Abrasive Water-Jet
Two Dimensional Simulation for Gas-Solid-Liquid Three-Phase Flow of Abrasive Water Jet Nozzle and Experimental Validation
C.Z. Huang, R.G. Hou, J. Wang, H.T. Zhu, and Y.X. Feng
A Three-Dimensional Parameter Research for the Surface Texture in a New Finishing Process
F. Liu, Y.D. Gong, Y.Q. Shan, and G.Q. Cai
A New Predictive Model for the Depth of Cut in Abrasive Waterjet Contouring of Alumina Ceramics
J. Wang
Momentum Transfer Efficiency in Abrasive Waterjet Cutting
Vu Ngoc Pi and A.M. Hoogstrate
Development of an Abrasive Tank Separated-Type AJM Device—Study on Abrasive Jet Machining
Nobuhito Yoshihara, Masaru Amaha, Jiwang Yan, and Tsunemoto Kuriyagawa
Abrasive Conditioning and Dressing (Metal Bonds)
Laser Truing and Dressing of Bronze-Bonded Diamond Grinding Wheel and Its High-Speed Grinding Performance
G.Y. Chen, L.F. Mei, B. Zhang, W.M. You, J.Y. Yu, and K. Huang
On the Performance of Electro-Discharge Dressed Metal-Bond CBN Wheels
I. Pombo, J.A. Sanchez, R. Alberdi, B. Izquierdo, and L.N. Lopez de Lacalle
In-Process Electrolytic Dressing of a Metal Bonded Diamond Wheel by Using a Flexible Fluid Supplying Sheet
Toshiharu Shimizu, Chiharu Nagano, Manabu Iwai, Shinichi Ninomiya, Mei Wang, Masatoshi Sakurai, Tetsutaro Uematsu, and Kiyoshi Suzuki
In-Process Electrodischarge Dressing of Metal Bonded Diamond Wheels by Using a Floating Nozzle
Shinichi Ninomiya, Manabu Iwai, Mei Wang, Masatoshi Sakurai, Toshiharu Shimizu, Tetsutaro Uematsu, and Kiyoshi Suzuki
Abrasive Conditioning and Dressing
Effect of Dressing Condition on the Contact Stiffness of Vitrified Grinding Wheels
Takazo Yamada and Hwa-Soo Lee
A Method for Synchronizing Grinding Wheel and Form Roll Speed in Point Crush Profiling of Grinding Wheels
J.M. Derkx, A.M. Hoogstrate, B. Karpuschewski, and J.J. Saurwalt
Grinding Wheel Texture and Diamond Roll Plunge Dressing Feed-rates
C.A. Brown, R.S. Hahn, R.M. St. Gelais, B. Powers, D.J. Geiger, and T.S. Bergstrom
Powder Deposition
Study on Powder Jet Deposition—Development of Double Nozzle Type Powder Jet Deposition Device
Toshihiko Shibuya, Koichi Mizutani, Nobuhito Yoshihara, Jiwang Yan, Tsunemoto Kuriyagawa, and Mohammad Saeed Sepasy Zahmaty
Creating a Hydroxyapatite Film on Human Enamel by Powder Jet Deposition Technique
Miyoko Noji, Mohammad Saeed Sepasy Zahmaty, Toshihiko Shibuya, Nobuhito Yoshihara, Tsunemoto Kuriyagawa, Keiichi Sasaki, and Osamu Suzuki
rev 4/1/2009