CHEMICAL MECHANICAL PLANARIZATION OF MICROELECTRONIC MATERIALS

by Joseph Steigerwald and others
Wiley 1997, 324 pages.
Available from AES for $136 plus shipping
Price change without notice

Donít let the title confuse you. This is a book about a material removal process using abrasives. Chemical Mechanical Planarization (CMP) is a method of producing extremelly flat surfaces on materials such as tungsten, aluminum or silicon using aluminum oxide, silica, or cerium oxide abrasives. CMP is the preminent process for ultraprecision machining of composite materials that have layers with different mechanical properties. Written by pioneers in the CMP process from Rensselaer Polytechnic Institute, this work provides a history of CMP and gives insight into the mechanisms and techniques of achieving ultrafine dimensional finishing of flat surfaces. CMP is used to make silicon integrated circuits with materials less than 5 micron thick. This is a source to explore choice of abrasive, the role of chemistry in polishing, the construction of pads that carry the abrasive slurry and apply pressure, particle dispersion in slurries and methods of cleaning residues. This is the first comprehensive book on an process that is critical to the modern microelectronics industry. Note. 3/15/07. Though now dated, this book is still an essential resource for those serious about a technology that is a core process in the electronics industry and the reason for national and international conference.
  • Chapters 1 and 2: introduce the CMP process and historical motivations.
  • Chapter 2: has the current status of CMP technology and advanced planarization schemes.
  • Chapter 3: lists the multitude of variables that affect control of CMP processes. Many of the same issues concerned in polishing and buffing are described here.
  • Chapter 4: has the mechanical and chemical scientific principles behind the CMP processes.
  • Chapter 5: discusses creating flat planes on silicon dioxide.
  • Chapter 6: gives details of CMP applications for tungsten and copper.
  • Chapters 7 and 8: describe process developments with new materials.
  • Chapter 9: discusses cleaning science and technology to remove abrasives and swarf.

    Even if you are not directly concerned with finishing of electronic components, here is source that describes important advances in abrasives finishing technology. For ordering information or a more detailed table of contents CONTACT AES.


    ©Abrasive Engineering Society 2007

    rev 3/15/07