Precision Machining
of Advanced Materials

by Liangchi Zhang, Editor
Department of Mechanical and Mechatronic Engineering
The University of Sydney

220 pages, Transtech Publications, released in Spring 2001,
available for $85.00 USD plus shipping and handling. Price subject to international exchange rates and there may change without notice.

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  • Prefac...v..To read preface click here
  • Mechanisms
    • Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor by H Hocheng, H Y Tsai, Y L Huang 1
    • A Noval Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process J Watanabe, R Etoh, M Hirano 25
    • Handling the Molecular Dynamics Simulation for Nano-Machining D Cheong, H Tanaka, L Zhang 31
    • The Exit Defects in Drilling Carbon Fibre-Reinforced Plastics H Zhang, W Chen, D Chen, L Zhang 43
    • Grinding of Ceramics: Strength, Surface Features and Grinding Conditions T Liu, B A Latella and L Zhang 3
    • Grinding Burn Mechanism of Directionally Solidified Superalloy M Chen, F Sun, B Xue 61
  • Friction and Wear
    • Wear Mechanism of Diamond Cutting Tool in Machining of Steel H Tanaka, S Shimada, N Ikawa, M Yoshinaga 69
    • A Friction Model for Free-Machining Steels and Its Applicability to Machinability Analysis K Maekawa, A Kubo, T H C Childs . 79
    • Improvement of Friction and Wear Properties of CVD-SiC Films with New Surface Finishing Method “ELID-Grinding” T Kato, H Ohmori, C Zhang, T Yamazaki, Y Akune, K Hokkirigawa 91
  • Methods and Tools
    • A New Device of Abrasive Jet Machining and Application to Abrasive Jet Printer T Kuriyagawa, T Sakuyama, K Syoji, H Onodera 103
    • On-Machine Monitoring of the Wheel Working Surface Condition with the Relative Frequency Distribution of Its Profile S Shimizu, H Sakamoto 111
    • On-Machine Monitoring of the Wheel Working Surface Condition with the Fractal Dimension Analysis of Its Profile H Sakamoto, S Shimizu 121
    • Fabrication of Metal-Bonded Grinding/Polishing Tools by Green Tape Laser Sintering Method K Maekawa, Y Yokoyama, I Ohshima 133
    • Abrasive Capacity of Thin Film Diamond Structures J Andersson, P Hollman, S Jacobson 141
    • Micro Hole Machining of Borosilicate Glass through Electrochemical Discharge Machining (ECDM) C T Yang, S S Ho, B H Yan 149
    • Micro-Spherical Lens Mold Fabrication by Cup-Type Metal-Bond Grinding Wheels Applying ELID (Electrolytic In-Process Dressing) T Matsuzawa, H Ohmori, C Zhang, W Li, Y Yamagata, S Moriyasu, A Makinouchi 167
    • Threading of Inclusion Modified Steels with Coated Carbide Tools E Ezugwu, C I Okeke 177
    • CVD Diamond Coating Technologies and Application in Cutting Abrasive Materials M Chen, F Sun, Z Zhang 193
  • Subject Index 199
  • Author Index 218
Precision machining is an essential manufacturing process to achieve high dimensional accuracy and high surface integrity of functional components for various technological applications, such as those in aeronautical, biomedical, mechanical, metrological, mechatronic, nano-technological and microscopy industries. To achieve a satisfactory operation of precision machining, however, one must have a deep understanding of the setting and control of machining conditions, mechanisms of material removal and effectiveness of the cutting tools. As a result, a quality precision machining requires a comprehensive integration of the development of machine tools, the improvement of machining methods and the wise application of materials science and engineering and mechanics of solids. This volume tends to present to the reader the state-of-the-art information about the recent research, development and applications on the precision machining of advanced materials. It covers three major aspects of precision machining, i.e., mechanisms of machining and material removal, friction and wear problems associated with cutting tools and development of new methods and new tools for more cost-effective processes. Individual materials have different properties and thus require different machining methods and conditions to achieve high surface integrity and accuracy. For example, silicon monocrystalls are brittle in nature and are chemically sensitive to machining environment. Composites have at least two phases with different mechanical properties. These need to be considered carefully in machining as otherwise unacceptable damage will take place in either the workpiece or the cutting tool or in both. The papers included in this volume deal with a wide range of difficult-to-machine materials, such as silicon, glass, carbon-fibre reinforced composites, CVD-SiC film and ceramics. The methodologies presented address both industrial production problems and fundamental issues, including polishing, grinding, electrochemical discharge machining, abrasive jet machining, laser sintering, chemo-mechanical machining, drilling, fractal analysis, molecular dynamics analysis and finite element simulation. The volume is therefore valuable to production and research engineers, research students and academics in the area. I would like to acknowledge the authors for their contributions to this special issue, the referees for reviewing the manuscripts and Trans Tech Publication for making the volume available to the professional community. In particular, I would like to thank Dr Fred H Wöhlbier, the President of Trans Tech Publication and the Editor of Key Engineering Materials, for his prompt assistance throughout the process. ---L Zhang.
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rev 2/25/03
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