CHEMICAL MECHANICAL POLISHING (PLANARIZATION)
- Chemical Mechanical Polishing (CMP) in Magnetic Float Polishing (MFP) of Advanced Ceramic (Silicon Nitride) and Glass (Silicon Dioxide) M. Jiang and R. Komanduri #03-01
- Experimental Research on Flow during CMP Processes J.L. Yuan, B. Lin, Z.W. Shen, J.J. Zheng, J. Ruan and L.B. Zhang #03-85
- Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor H. Hocheng, H.Y. Tsai and Y.-L. Huang #6-01
- A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing ProcessJ. Watanabe, R. Etoh and M. Hirano #6-25
- Preliminary Radiological In Vivo Study of Calcium Metaphosphate Coated Ti-Alloy Implants by S.W. Kim, S. Oh, C.K. You, M.W. Ahn, K.H. Kim, I.K. Kang, J.H. Lee, S. Kim #K254 -881 ask for abstract
- Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing by J. Watanabe, T. Hisamatsu, M. Hirano #K257-407 ask for abstract
- Influence of the Surface Topography on the Micromechanical Properties and Performance of a CMP Finished AlN Component for Silicon Plasma Etching by L. Chouanine, M. Takano, F. Ashihara, O. Kamiya #K261-1566 ask for abstract
- Chemi-Mechanical Polishing of On-Axis Semi-Insulating SiC Substrates by V.D. Heydemann, W.J. Everson, R.D. Gamble, D.W. Snyder, M. Skowronski #M457-805 ask for abstract
- Chemi-Mechanical Polishing of On-Axis Semi-Insulating SiC Substrates by V.D. Heydemann, W.J. Everson, R.D. Gamble, D.W. Snyder, M. Skowronski #K240-419 ask for abstract
- Surface Modification of 3C-SiC for Good Ni Ohmic Contact by Jae Il Noh, Seung Hyun Lee, Kee Suk Nahm #M457-809 ask for abstract
- Kinematic Analysis of Chemical Mechanical Polishing and its Effect on Polishing Results by Hyoungjae Kim, Hoyun Kim, Haedo Jeong, Sunghoon Lee, David Dornfeld 238 229 KEY #K238-299ask for abstract
- Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer by J.X. Su, D.M. Guo, R.K. Kang, Z.J. Jin, X.J. Li, Y.B. Tian #M471-26 ask for abstract
- A Study of the Characteristics of the Diamond Dresser in the CMP Process by Y.S. Liao, P.W. Hong, C.T. Yang #K257-371 ask for abstract
- PLGA-CMP Composite Scaffold for Articular Joint Resurfacing by J.H. Jeong, S.K. Park, D.J. Lee, Y.M. Moon, D.C. Lee, H.I. Shin, S. Kim #K254-1123 ask for abstract
- Surface Preparation of 6H-Silicon Carbide Substrates for Growth of High-Quality SiC Epilayers by K.S. Lee, S.H. Lee, M. Kim, K.S. Nahm #M457-797 ask for abstract
- A Study on the Dressing Rate in CMP Pad Conditioning by P.L. Tso, S.Y. Ho #K257-377 ask for abstract
- Physical and Chemical Characteristics of the Ceramic Conditioner in Chemical Mechanical Planarization by Jum-Yong Park, Dae-Hong Eom, Sang-Ho Lee, Beom-Young Myung, Sang-Ick Lee, Jin-Goo Park #K238-223 ask for abstract
- Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance by D.H. Eom, J.S. Ryu, J.G. Park, J.J. Myung, K.S. Kim #K257-389 ask for abstract
- A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process by D.H. Lee, D.J. Kwon, Y.K. Hong, J.G. Park #K257-433 ask for abstract
- Effects of Additives on Pore Structures in Freeze Dried Calcium Phosphate Granules by S.H. Oh, S.W. Kim, M.H. Ahn, C.K. You, H.I. Shin, S.Y. Kim #K240-493 ask for abstract
- Pad Surface Characterization and its Effect on the Tribological State in Chemical Mechanical Polishing by H. Kim, H. Jeong, E. Lee, Y. #K257-383 ask for abstract
- Mechanochemical Synthesis of Nano-Sized CeO2 and its Application for CMP Slurry by Geonja Lim, Jong-Ho Lee, Joosun Kim, Hae-Weon Lee, Sang-Hoon Hyun #M449-1105 ask for abstract
- A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method by J. Choi, H. Kim, J. Park, S. Chung, H. Jeong, M. Kinoshita #K257-413 ask for abstract
- Electro-Chemical Mechanical Polishing of Silicon Carbide by Canhua Li, Rongjun Wang, Joseph Seiler, Ishwara Bhat #M457-01 ask for abstract
- Study on the Surface Quality of LiNbO3 Wafer by CMP by T. Xing, J.L. Yuan, W. Li, S.M. Ji, L.B. Zhang, W.H. Zhao #K259-644 ask for abstract
- Advanced PVT Growth of 2 & 3-Inch Diameter 6H SiC Crystals by T.A. Anderson, D.L. Barrett, J. Chen, W.T. Elkington, E. Emorhokpor, A. Gupta, C.J. Johnson, R.H. Hopkins, C. Martin, T. Kerr, E. Semenas, A.E. Souzis, C.D. Tanner, M. Yoganathan, I. Zwieback #M457-75 ask for abstract
- Ultra Precision Polishing with Oscillation Speed Control: an Analysis of the Pressure Distribution and Profile by Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida #K238-219 ask for abstract
- Defect Influence on the Electrical Properties of 4H-SiC Schottky Diodes by L. Scaltrito, E. Celasco, S. Porro, S. Ferrero, F. Giorgis, C.F. Pirri, D. Perrone, U. Meotto, P. Mandracci, G. Richieri, L. Merlin, A. Cavallini, A. Castaldini, M. Rossi #M457-1081 ask for abstract
- Large Diameter 4H-SiC Substrates for Commercial Power Applications by A.R. Powell, R.T. Leonard, M.F. Brady, St.G. Müller, V.F. Tsvetkov, R. Trussell, J.J. Sumakeris, H.McD. Hobgood, A.A. Burk, R.C. Glass, C.H. Carter, Jr. #K254-631 ask for abstract
- Successful Osteoinduction by Macroporous Calcium Metaphosphate Ceramic-Osteoblastic Cell Complex Implantation by S.H. Oh, S.Y. Kim, E.K. Park, S.Y. Kim, J.H. Chung, H.M. Ryoo, K.H. Kim, H.I. Shin #K254-631 ask for abstract
- Development and Performance Test of a Micromachined Resonant Accelerometer by Sangkyung Sung, Taesam Kang, Chul Hyun, Byeungleul Lee, Jang Gyu Lee, Chan Gook Park, Young #K261-1575 ask for abstract
- 3-D Kirchhoff Migration of GPR Data to Image the Inside of a Stone Pagoda by Yun Gyeong Choi, Jung Hee Suh, Nu Ree Han, Ji Hyang Choi, Young Ho Cha #K277-481 ask for abstract
- An Analysis of the Pad Deformation for Improved Planarization by Thin-Lin Horng #K238-241 ask for abstract
- Development of New Mica Abrasives Suitable for High Performance Mechanochemical Polishing of Si Wafers by Nobuo Yasunaga, Shojiro Okada #K238-253 ask for abstract
- Short History of Body Force Method and its Application to Various Problems of Stress Analysis by H. Nisitani, A. Saimoto #M440-161 ask for abstract
- Effectiveness of Two-Dimensional Versatile Program Based on Body Force Method and its Application to Crack Problems by H. Nisitani, A. Saimoto #K251-97 ask for abstract
- Dislocation Generation in Device Fabrication Process by Isabella Mica, Maria-Luisa Polignano, G.P. Carnevale, A. Armigliato, R. Balboni, M. Brambilla, F. Cazzaniga, G. Pavia, V. Soncini #SP95-439 ask for abstract
- Development of a Grinding Wheel with Electrically Conductive Diamond Cutting Edges by K. Suzuki, M. Iwai, T. Uematsu , A. Sharma #K257-239 ask for abstract
- Micro-Polishing of Complex and Flat Parts Using a Chemical Oil Based ER Fluid by J.J. Lee, E.S. Lee, S.K. Min, Y.H. Kim, K.H. Hwang #K257-477 ask for abstract
- Micro-Polishing of Complex and Flat Parts Using a Chemical Oil Based ER Fluid by J.J. Lee, E.S. Lee, S.K. Min, Y.H. Kim, K.H. Hwang #K257-429 ask for abstract
- Positronium Annihilation Lifetime Spectroscopy of Porous Low-k Films with Periodic Pore Structures by Toshiyuki Ohdaira, Ryoichi Suzuki, Hironobu, Shirataki, Shin-Ya Matsuno #M445-334 ask for abstract
- Measurement of Mechanical Properties of Electroplated Nickel Thin Film by Dong-Cheon Baek, Tae-Sang Park, Soon-Bok Lee #K261-417 ask for abstract
- Development of a Micro Gyroscope Using Epitaxial Polysilicon and Its Performance Test by Woon Tahk Sung, Hyung-Taek Lim, Taesam Kang, Jang Gyu Lee, Young Jae Lee #K261-495 ask for abstract
- Refractory Formulations Made of Different Wastes and Natural Sub-Products by F.R. Pereira, A.F. Nunes, A.M. Segadães, J.A. Labrincha #K264-1743 ask for abstract
|