INTERNATIONAL TECHNICAL PAPERS ON ABRASIVES TECHNOLOGY
Technical papers available from AES include those contained in publications of Trans Tech, some of which are listed below. The papers below with numbers beginning with #03 are selected for the 11th Grinding and Machining Conference held in Quanzhou, China on June 2-6, 2001. These papers show that development of grinding technology in China and nearby countries is in step with programs in the US and Europe.
Papers with numbers beginning with #6 are papers assembled by L C Zhang and others from international meetings in Australia, Malaysia, Japan and China on precision grinding of ceramics.
Many other compilations on the AES website include technical papers with subject indexes and abstracts that can be viewed and downloaded. Click here for a some of those publications.

Individual papers cost $35 each and can be sent through e-mail as a file attachment. Payment by credit card or through Paypal.com is preferred. For additional information contact AES.

You can view other volumes for this series of research publications at :

  • 13th Conference of Abrasive Technology in China August 20-22, 2005 Link
  • Grinding and Machining Conference in China (GMC 2003) Link
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    COATED ABRASIVES

  • Abrasive Capacity of Thin Film Diamond Structures J. Andersson, P. Hollman and S. Jacobson #6-141

    • GRINDING WHEEL CONSTRUCTION--bonds, grain coatings,

  • CVD Diamond Coating Technologies and Application in Cutting Abrasive Materials Ming Chen, Fanghong Sun and Zhiming Zhang #6-?
  • Development of a Dicing Blade Using Light-Hardening Resin W. Peng, W. Huang and X.F. Xu #03-99

    • THERMAL ASPECTS OF GRINDING--Damage, coolants, modeling, etc.

  • Fuzzy Contact and Its Effect on Thermal Damage in Grinding Processes H.S. Qi, W.B. Rowe and B. Mills #03-15
  • A Complex Thermal Model for Deep Grinding G.Q. Cai, T. Jin and B.F. Feng #03-41
  • Research on Enhancing Heat Transfer in Grinding Contact Zone with Radial Water Jet Impinging Cooling H.J. Xu, Y.C. Fu and F.H. Sun #03-53
  • Significance of Grinding Temperature in Metal Removal D.W. Zuo and T. Matsuo #03-57
  • Theoretical Analysis of Temperature Field in Surface Grinding with Cup Wheel B. Lin and H.L. Zhang #03-93
  • Grinding Burn Mechanism of Directionally Solidified Superalloy Ming Chen, Fanghong Sun and Bingyuan Xue #6-61
  • A Study of Turning Operation by Oil-Water Combined Mist Lubrication Machining Method D.C. Chen, Y. Suzuki and K. Sakai #03-47

    • DRESSING --Tecahniques, ELID, monitoring...

  • Ultra-Precision Grinding of Ceramic Glass with ELID Technique F.H. Zhang, Z.J. Qiu and D.R. Luan #03-103
  • Wear Mechanism of Diamond Cutting Tool in Machining of Steel H. Tanaka, S. Shimada, N. Ikawa and M. Yoshinaga #6-69
  • Improvement of Friction and Wear Properties of CVD-SiC Films with New Surface Finishing Method 'ELID-Grinding' T. Kato, H. Ohmori, C. Zhang, T. Yamazaki, Y. Akune and K. Hokkirigawa #6-91
  • Fabrication of Metal-Bonded Grinding/Polishing Tools by Greentape Laser Sintering Method K. Maekawa, Y. Yokoyama and I. Ohshima #6-133
  • On-Machine Monitoring of the Wheel-Working Surface Condition with the Relative Frequency Distribution of its Profile S. Shimizu and H. Sakamoto #6-111
  • On-Machine Monitoring of the Wheel Working Surface Condition with the Fractal Dimension Analysis of Its Profile H. Sakamoto and S. Shimizu #6-121

    • METALWORKING FLUIDS--Coolants, application methods, minimal fluid applications, etc.

  • A Study of Turning Operation by Oil-Water Combined Mist Lubrication Machining Method D.C. Chen, Y. Suzuki and K. Sakai #03-47
  • Compliant EDM for Free-Form Surfaces Polishing J.M. Zhan, J. Zhao and M. Yu #03-73
  • The Application of the Lubrication Theory to the Surface Grinding P.Q. Ge, J.G. Sun and Z.C. Liu #03-89

    • SURFACES AND PROPERTIES OF MATERIALS BEING GROUND

  • Bifractal Characteristics of Ground Workpiece Surfaces S.F. Lu, Y.S. Gao and Z. Li #03-25
  • Experimental Study on the Single-Grit Grinding Titanium Alloy TC4 and Superalloy GH4169 B.F. Feng and G.Q. Cai #03-115

    • SURFACE QUALITY AND MEASUREMENT

  • Surface Integrity and Modification of Diamond Wheel Ground Engineering Ceramics C.L. Wu, Q.H. Zhang, J.H. Zhang and T.C. Lee #03-109
  • A Study on Surface Quality of Ultraprecision Grinding for Engineering Ceramics S.Y. Yu, X.S. Han, B. Lin and B. Lin #03-35f #03-35

    • GRINDING CERAMICS

  • Grinding of Ceramics: Strength, Surface Features and Grinding Conditions Tianshun Liu, Bruno A. Latella and Liangchi Zhang #6-53

    • SPECIFIC APPLICATIONS

  • Study on Performance of CBN Cup Quill for Face Grinding Q.S. Yan, Z.Q Zhang and K. Syoji #03-79
  • A New Device of Abrasive Jet Machining and Application to Abrasive Jet Printer Tsunemoto Kuriyagawa, Takashi Sakuyama, Katsuo Syoji and Hiromitsu Onodera #6-103

    • PROCESS CONTROL

  • On-Machine Monitoring of the Wheel-Working Surface Condition with the Relative Frequency Distribution of its Profile S. Shimizu and H. Sakamoto #6-111
  • On-Machine Monitoring of the Wheel Working Surface Condition with the Fractal Dimension Analysis of Its Profile H. Sakamoto and S. Shimizu #6-121

    • CHEMICAL MECHANICAL POLISHING (PLANARIZATION)

    • Chemical Mechanical Polishing (CMP) in Magnetic Float Polishing (MFP) of Advanced Ceramic (Silicon Nitride) and Glass (Silicon Dioxide) M. Jiang and R. Komanduri #03-01
    • Experimental Research on Flow during CMP Processes J.L. Yuan, B. Lin, Z.W. Shen, J.J. Zheng, J. Ruan and L.B. Zhang #03-85
    • Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor H. Hocheng, H.Y. Tsai and Y.-L. Huang #6-01
    • A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing ProcessJ. Watanabe, R. Etoh and M. Hirano #6-25
    • Preliminary Radiological In Vivo Study of Calcium Metaphosphate Coated Ti-Alloy Implants by S.W. Kim, S. Oh, C.K. You, M.W. Ahn, K.H. Kim, I.K. Kang, J.H. Lee, S. Kim #K254 -881 ask for abstract
    • Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing by J. Watanabe, T. Hisamatsu, M. Hirano #K257-407 ask for abstract
    • Influence of the Surface Topography on the Micromechanical Properties and Performance of a CMP Finished AlN Component for Silicon Plasma Etching by L. Chouanine, M. Takano, F. Ashihara, O. Kamiya #K261-1566 ask for abstract
    • Chemi-Mechanical Polishing of On-Axis Semi-Insulating SiC Substrates by V.D. Heydemann, W.J. Everson, R.D. Gamble, D.W. Snyder, M. Skowronski #M457-805 ask for abstract
    • Chemi-Mechanical Polishing of On-Axis Semi-Insulating SiC Substrates by V.D. Heydemann, W.J. Everson, R.D. Gamble, D.W. Snyder, M. Skowronski #K240-419 ask for abstract
    • Surface Modification of 3C-SiC for Good Ni Ohmic Contact by Jae Il Noh, Seung Hyun Lee, Kee Suk Nahm #M457-809 ask for abstract
    • Kinematic Analysis of Chemical Mechanical Polishing and its Effect on Polishing Results by Hyoungjae Kim, Hoyun Kim, Haedo Jeong, Sunghoon Lee, David Dornfeld 238 229 KEY #K238-299ask for abstract
    • Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer by J.X. Su, D.M. Guo, R.K. Kang, Z.J. Jin, X.J. Li, Y.B. Tian #M471-26 ask for abstract
    • A Study of the Characteristics of the Diamond Dresser in the CMP Process by Y.S. Liao, P.W. Hong, C.T. Yang #K257-371 ask for abstract
    • PLGA-CMP Composite Scaffold for Articular Joint Resurfacing by J.H. Jeong, S.K. Park, D.J. Lee, Y.M. Moon, D.C. Lee, H.I. Shin, S. Kim #K254-1123 ask for abstract
    • Surface Preparation of 6H-Silicon Carbide Substrates for Growth of High-Quality SiC Epilayers by K.S. Lee, S.H. Lee, M. Kim, K.S. Nahm #M457-797 ask for abstract
    • A Study on the Dressing Rate in CMP Pad Conditioning by P.L. Tso, S.Y. Ho #K257-377 ask for abstract
    • Physical and Chemical Characteristics of the Ceramic Conditioner in Chemical Mechanical Planarization by Jum-Yong Park, Dae-Hong Eom, Sang-Ho Lee, Beom-Young Myung, Sang-Ick Lee, Jin-Goo Park #K238-223 ask for abstract
    • Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance by D.H. Eom, J.S. Ryu, J.G. Park, J.J. Myung, K.S. Kim #K257-389 ask for abstract
    • A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process by D.H. Lee, D.J. Kwon, Y.K. Hong, J.G. Park #K257-433 ask for abstract
    • Effects of Additives on Pore Structures in Freeze Dried Calcium Phosphate Granules by S.H. Oh, S.W. Kim, M.H. Ahn, C.K. You, H.I. Shin, S.Y. Kim #K240-493 ask for abstract
    • Pad Surface Characterization and its Effect on the Tribological State in Chemical Mechanical Polishing by H. Kim, H. Jeong, E. Lee, Y. #K257-383 ask for abstract
    • Mechanochemical Synthesis of Nano-Sized CeO2 and its Application for CMP Slurry by Geonja Lim, Jong-Ho Lee, Joosun Kim, Hae-Weon Lee, Sang-Hoon Hyun #M449-1105 ask for abstract
    • A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method by J. Choi, H. Kim, J. Park, S. Chung, H. Jeong, M. Kinoshita #K257-413 ask for abstract
    • Electro-Chemical Mechanical Polishing of Silicon Carbide by Canhua Li, Rongjun Wang, Joseph Seiler, Ishwara Bhat #M457-01 ask for abstract
    • Study on the Surface Quality of LiNbO3 Wafer by CMP by T. Xing, J.L. Yuan, W. Li, S.M. Ji, L.B. Zhang, W.H. Zhao #K259-644 ask for abstract
    • Advanced PVT Growth of 2 & 3-Inch Diameter 6H SiC Crystals by T.A. Anderson, D.L. Barrett, J. Chen, W.T. Elkington, E. Emorhokpor, A. Gupta, C.J. Johnson, R.H. Hopkins, C. Martin, T. Kerr, E. Semenas, A.E. Souzis, C.D. Tanner, M. Yoganathan, I. Zwieback #M457-75 ask for abstract
    • Ultra Precision Polishing with Oscillation Speed Control: an Analysis of the Pressure Distribution and Profile by Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida #K238-219 ask for abstract
    • Defect Influence on the Electrical Properties of 4H-SiC Schottky Diodes by L. Scaltrito, E. Celasco, S. Porro, S. Ferrero, F. Giorgis, C.F. Pirri, D. Perrone, U. Meotto, P. Mandracci, G. Richieri, L. Merlin, A. Cavallini, A. Castaldini, M. Rossi #M457-1081 ask for abstract
    • Large Diameter 4H-SiC Substrates for Commercial Power Applications by A.R. Powell, R.T. Leonard, M.F. Brady, St.G. Müller, V.F. Tsvetkov, R. Trussell, J.J. Sumakeris, H.McD. Hobgood, A.A. Burk, R.C. Glass, C.H. Carter, Jr. #K254-631 ask for abstract
    • Successful Osteoinduction by Macroporous Calcium Metaphosphate Ceramic-Osteoblastic Cell Complex Implantation by S.H. Oh, S.Y. Kim, E.K. Park, S.Y. Kim, J.H. Chung, H.M. Ryoo, K.H. Kim, H.I. Shin #K254-631 ask for abstract
    • Development and Performance Test of a Micromachined Resonant Accelerometer by Sangkyung Sung, Taesam Kang, Chul Hyun, Byeungleul Lee, Jang Gyu Lee, Chan Gook Park, Young #K261-1575 ask for abstract
    • 3-D Kirchhoff Migration of GPR Data to Image the Inside of a Stone Pagoda by Yun Gyeong Choi, Jung Hee Suh, Nu Ree Han, Ji Hyang Choi, Young Ho Cha #K277-481 ask for abstract
    • An Analysis of the Pad Deformation for Improved Planarization by Thin-Lin Horng #K238-241 ask for abstract
    • Development of New Mica Abrasives Suitable for High Performance Mechanochemical Polishing of Si Wafers by Nobuo Yasunaga, Shojiro Okada #K238-253 ask for abstract
    • Short History of Body Force Method and its Application to Various Problems of Stress Analysis by H. Nisitani, A. Saimoto #M440-161 ask for abstract
    • Effectiveness of Two-Dimensional Versatile Program Based on Body Force Method and its Application to Crack Problems by H. Nisitani, A. Saimoto #K251-97 ask for abstract
    • Dislocation Generation in Device Fabrication Process by Isabella Mica, Maria-Luisa Polignano, G.P. Carnevale, A. Armigliato, R. Balboni, M. Brambilla, F. Cazzaniga, G. Pavia, V. Soncini #SP95-439 ask for abstract
    • Development of a Grinding Wheel with Electrically Conductive Diamond Cutting Edges by K. Suzuki, M. Iwai, T. Uematsu , A. Sharma #K257-239 ask for abstract
    • Micro-Polishing of Complex and Flat Parts Using a Chemical Oil Based ER Fluid by J.J. Lee, E.S. Lee, S.K. Min, Y.H. Kim, K.H. Hwang #K257-477 ask for abstract
    • Micro-Polishing of Complex and Flat Parts Using a Chemical Oil Based ER Fluid by J.J. Lee, E.S. Lee, S.K. Min, Y.H. Kim, K.H. Hwang #K257-429 ask for abstract
    • Positronium Annihilation Lifetime Spectroscopy of Porous Low-k Films with Periodic Pore Structures by Toshiyuki Ohdaira, Ryoichi Suzuki, Hironobu, Shirataki, Shin-Ya Matsuno #M445-334 ask for abstract
    • Measurement of Mechanical Properties of Electroplated Nickel Thin Film by Dong-Cheon Baek, Tae-Sang Park, Soon-Bok Lee #K261-417 ask for abstract
    • Development of a Micro Gyroscope Using Epitaxial Polysilicon and Its Performance Test by Woon Tahk Sung, Hyung-Taek Lim, Taesam Kang, Jang Gyu Lee, Young Jae Lee #K261-495 ask for abstract
    • Refractory Formulations Made of Different Wastes and Natural Sub-Products by F.R. Pereira, A.F. Nunes, A.M. Segadães, J.A. Labrincha #K264-1743 ask for abstract

    OTHER

  • Some Essentials of Simulating Nano-Surfacing Processes Using the Molecular Dynamics Method Wun Chet Davy Cheong, Liangchi Zhang and Hiroaki Tanaka #6-31
  • Assessment of the Exit Defects in Carbon Fibre-Reinforced Plastic Plates Caused by Drilling Houjiang Zhang, Wuyi Chen, Dingchang Chen and Liangchi Zhang #6-43
  • Micro Hole Machining of Borosilicate Glass through Electrochemical Discharge Machining (ECDM) C.T. Yang, S.S. Ho and B.H. Yan #6-149
  • Threading of Inclusion Modified Steels with Coated Carbide Tools E.O. Ezugwu and C.I. Okeke #6-177
  • A Friction Model for Free-Machining Steels and Its Applicability to Machinability Analysis K. Maekawa, A. Kubo and T.H.C. Childs #6-79
    • RETURN rev 6/20/2010
    © 2010 AES